US12728623 - Reformable epoxy resin for composites and methods thereof

The invention relates to a method for creating composite structures using reformable epoxy resin layers that allow for reshaping through heating. This process enables the formation of non-planar composite structures from initially planar designs, enhancing versatility in composite applications.

Claim 1

1 . A method comprising: (i) forming a substantially planar composite structure having at least two layers, and a reformable epoxy resin adhesive material between the at least two layers; (ii) optionally cutting the composite structure to a desired shape; (iii) heating the substantially planar composite structure in a mold to form a non-planar composite structure; wherein the reformable epoxy resin adhesive material falls below its glass transition temperature upon exposure to ambient temperature; after the reformable epoxy resin adhesive material falls below its glass transition temperature, it can be heated multiple times above its glass transition temperature for molding into a non-planar composite structure. (i) forming a substantially planar composite structure having at least two layers, and a reformable epoxy resin adhesive material between the at least two layers; (ii) optionally cutting the composite structure to a desired shape; (iii) heating the substantially planar composite structure in a mold to form a non-planar composite structure; wherein the reformable epoxy resin adhesive material falls below its glass transition temperature upon exposure to ambient temperature; after the reformable epoxy resin adhesive material falls below its glass transition temperature, it can be heated multiple times above its glass transition temperature for molding into a non-planar composite structure.

Google Patents

https://patents.google.com/patent/US12728623

USPTO PDF

https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/12728623