US12679080 - Phenolic panel and attachment/detachment system and process
This patent describes a system for attaching a phenolic laminate panel to a metal part using a combination of adhesives that respond to electromagnetic heating. The process involves heating the laminate to a specific temperature to melt a lower melting point adhesive, allowing it to bond securely to the metal while preserving the integrity of higher melting point adhesives.
Claim 1
1 . A panel attachment system, the panel attachment system comprising: a laminate panel, the laminate panel comprising (i) a non-magnetic panel having an outer side and an inner side, (ii) a ferromagnetic susceptor having an outer side bonded at the inner side of the non-magnetic panel via a first layer of a higher melting point adhesive and (iii) a non-magnetic shield having an outer side bonded at an inner side of the ferromagnetic susceptor, opposite from the outer side of the ferromagnetic susceptor, via a second layer of higher melting point adhesive; a layer of a lower melting point adhesive is applied at an inner side of the non-magnetic shield opposite from the outer side of the non-magnetic shield; wherein the lower melting point adhesive has a melting point below a melting point of the higher melting point adhesive, and wherein the lower melting point adhesive melts and bonds-when heated to a temperature above the melting point of the lower melting point adhesive; wherein, with the laminate panel disposed at a metal part, an electromagnetic field is generated at the laminate panel to heat the laminate panel to a first temperature that is greater than the melting point of the lower melting point adhesive and less than the melting point of the higher melting point adhesive; and with the laminate panel heated to the first temperature, the lower melting point adhesive melts, and wherein the lower melting point adhesive cures to bond the laminate panel to the metal part. a laminate panel, the laminate panel comprising (i) a non-magnetic panel having an outer side and an inner side, (ii) a ferromagnetic susceptor having an outer side bonded at the inner side of the non-magnetic panel via a first layer of a higher melting point adhesive and (iii) a non-magnetic shield having an outer side bonded at an inner side of the ferromagnetic susceptor, opposite from the outer side of the ferromagnetic susceptor, via a second layer of higher melting point adhesive; a layer of a lower melting point adhesive is applied at an inner side of the non-magnetic shield opposite from the outer side of the non-magnetic shield; wherein the lower melting point adhesive has a melting point below a melting point of the higher melting point adhesive, and wherein the lower melting point adhesive melts and bonds-when heated to a temperature above the melting point of the lower melting point adhesive; wherein, with the laminate panel disposed at a metal part, an electromagnetic field is generated at the laminate panel to heat the laminate panel to a first temperature that is greater than the melting point of the lower melting point adhesive and less than the melting point of the higher melting point adhesive; and with the laminate panel heated to the first temperature, the lower melting point adhesive melts, and wherein the lower melting point adhesive cures to bond the laminate panel to the metal part.
Google Patents
https://patents.google.com/patent/US12679080
USPTO PDF
https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/12679080