Apr 14, 2026

US12601576 - Sinter bonded projectile

The invention of the present subject matter relates to a sinter bonded projectile comprising a core component and a copper component which has been sintered in such a manner to form a solid mass over the core. More particularly, the invention of the present subject matter provides a core component to which a copper component is melted at a temperature sufficient that it penetrates into the pores and geometry of the core component under compression due to thermal shrinkage, resulting in a tightly bonded solid mass containing no voids. The invention of the present subject matter also provides a process for manufacturing the projectile.

Inventors: Roger J. Smith
Filing date: 2024-03-07

projectileammunitionsintered

The patent describes a sinter bonded projectile that features a tungsten carbide core surrounded by a copper component, which is sintered to create a solid mass without voids. Additionally, it outlines a manufacturing process that ensures the copper penetrates the core’s pores under thermal conditions, enhancing the bond between the materials.

Claim 1

1 . A sinter bonded projectile comprising a core component in the form of tungsten carbide and a copper component which is sintered around and into the core to form a tightly bonded solid mass containing no voids.

Google Patents

https://patents.google.com/patent/US12601576

USPTO PDF

https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/12601576