US12733099 - Electronics packaging for moving platforms

This patent describes a system for packaging electronics boards using interleaved plates that create an outer mold line for a moving platform. The design ensures that the plates and boards are stacked efficiently, optimizing space and structural integrity.
Claim 1
1 . A system, comprising: one or more electronics boards; and one or more plates configured to interleave the one or more electronics boards in a stack along an axis, each plate including a face configured to seat against a majority of a face of one of the one or more electronic boards; wherein, in the stack, an outer surface of the one or more plates is configured to form an outer mold line of a portion of an exterior surface of a moving platform, and wherein the outer surface has an outer circumference at an outer diameter of each of the one or more plates. one or more electronics boards; and one or more plates configured to interleave the one or more electronics boards in a stack along an axis, each plate including a face configured to seat against a majority of a face of one of the one or more electronic boards; wherein, in the stack, an outer surface of the one or more plates is configured to form an outer mold line of a portion of an exterior surface of a moving platform, and wherein the outer surface has an outer circumference at an outer diameter of each of the one or more plates.
Google Patents
https://patents.google.com/patent/US12733099
USPTO PDF
https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/12733099