Jan 27, 2026

US12535296 - Light source structure, sighting device thereof, and shooting device thereof

The present disclosure relates to the illuminant structure technical field. Disclosed are a light source structure, a sighting device and a shooting device, wherein the sight light source structure is used for the sighting device. The light source structure includes a substrate, a light-emitting chip arranged on the substrate, a bonding wire configured for electrically connecting the substrate and the light-emitting chip, and light-absorbing glue coated on the bonding wire. By improving the structure of the light source structure, specifically, by not covering the light-transmitting protective layer on the light-emitting chip, the light-transmitting protective layer is effectively prevented from reflecting light, so that the aiming point formed by the light at the light-emitting place is gathered, and the edge of the aiming point has no stray reflected light so that the wheel library at the edge of the aiming point is clear.

Assignee: PSG OPTO DEVELOPMENT CO., LTD
Inventors: San Su, Peng Liu
Filing date: 2024-01-16

sightingdevicelightsourcestructure

The patent describes a light source structure designed for use in sighting devices, featuring a light-emitting chip on a substrate and a bonding wire that connects them, along with light-absorbing glue to enhance performance. This innovative design prevents stray reflections, ensuring a clear aiming point for improved accuracy in shooting devices.

Claim 1

1 . A light source structure for a sighting device, comprising: a substrate; a light-emitting chip arranged on the substrate; a bonding wire configured to electrically connect the substrate and the light-emitting chip; light-absorbing glue configured to cover the bonding wire; and a transparent protective glue layer arranged on the substrate, wherein the transparent protective glue layer covers the substrate, the light-emitting chip, the bonding wire, and the light-absorbing glue. a substrate; a light-emitting chip arranged on the substrate; a bonding wire configured to electrically connect the substrate and the light-emitting chip; light-absorbing glue configured to cover the bonding wire; and a transparent protective glue layer arranged on the substrate, wherein the transparent protective glue layer covers the substrate, the light-emitting chip, the bonding wire, and the light-absorbing glue.

Google Patents

https://patents.google.com/patent/US12535296

USPTO PDF

https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/12535296