Apr 22, 2025

US12284785 - Assembly and method for cooling an apparatus

The present disclosure comprises an evaporative cooling assembly ( 200 ) for cooling an apparatus ( 220 ), and a method for cooling an apparatus ( 220 ). The evaporative cooling assembly comprises a refrigerant tank ( 202 ), the refrigerant tank ( 202 ) containing refrigerant ( 204 ). The apparatus also comprises a first evaporator ( 210 ) configured to be positioned proximal to the apparatus ( 220 ), and a second evaporator ( 216 ) positioned to cool the refrigerant tank ( 202 ). Each of the first evaporator ( 210 ) and the second evaporator ( 216 ) are in fluid communication with the refrigerant tank ( 202 ), and the second evaporator ( 216 ) is positioned downstream of the first evaporator ( 210 ). The method for cooling a heated apparatus ( 220 ) comprises passing a refrigerant ( 204 ) from a refrigerant tank ( 202 ) to a first evaporator ( 210 ), which is located proximal to the apparatus ( 220 ). At least part of the refrigerant is evaporated, and then passed to a second evaporator ( 216 ), which is positioned to cool the refrigerant tank ( 202 ).

The patent describes an evaporative cooling assembly designed to cool electronic apparatuses using a refrigerant tank and two evaporators. The first evaporator cools the apparatus while the second evaporator, positioned downstream, cools the refrigerant tank itself.

Claim 1

  1. An evaporative cooling assembly for cooling an electronic apparatus, the evaporative cooling assembly comprising: a refrigerant tank, the refrigerant tank containing refrigerant; a first evaporator positioned to cool the electronic apparatus; and a second evaporator; wherein the first evaporator is in fluid communication with the refrigerant tank; and the second evaporator is in fluid communication with the first evaporator, is positioned downstream of the first evaporator, and is positioned to cool the refrigerant tank. a refrigerant tank, the refrigerant tank containing refrigerant; a first evaporator positioned to cool the electronic apparatus; and a second evaporator; wherein the first evaporator is in fluid communication with the refrigerant tank; and the second evaporator is in fluid communication with the first evaporator, is positioned downstream of the first evaporator, and is positioned to cool the refrigerant tank.

Google Patents

https://patents.google.com/patent/US12284785

USPTO PDF

https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/12284785

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